Just a few days ago, some rumors tried to explain to us what happened to the Macs and Macbook Pro M2s, which should have arrived at the end of 2022 and which instead have been postponed to 2023. Today, an extremely reliable source has provided some important indiscretions on the Mac and Macbook launches scheduled for 2023 at Apple.
Specifically, this time it is the journalist of Bloomberg Mark Gurman, who first confirmed that the M2 Macbook Pros were due to arrive in 2022, but were delayed to the latest in early 2023: their launch should therefore take place for Apple’s spring keynote, set for the month of March 2023. Furthermore, Gurman added that the devices will be available in two sizes, i.e. with a 14″ and 16″ screen, and with chip M2 Max and M2 Pro. Another change compared to the predecessors should then be the Larger and faster RAM.
The new Mac Pro will conclude the M2 generation, which should be launched towards the middle of the year (perhaps at WWDC) in parallel with the new Mac Minis, the latter with M2 and M2 Pro chips, and perhaps the iMac Pro with M2 Pro chip and M2 Max. According to Gurman, the Mac Pro M2 will have an M2 Ultra chip, with a 24-Core CPU and a 76-Core GPU in maximum configuration, as well as 192GB RAM. Like the Mac Pro currently on the market, even the one with the M2 chip can be improved by users with new RAM and new storage.
Unfortunately, however, it seems that Apple canceled the M2 Extreme chip, which was supposed to be exclusive to the Mac Pro M2 (the M2 Ultra chip should in fact also be under the Mac Studio M2 body, if it ever comes out): the M2 Extreme SoC was supposed to have a 48-Core CPU and a 152-Core GPU. The price of the new Mac Pro, however, will not be the lowest: on the contrary, the desktop will cost a whopping $10,000 in the basic version.
Finally, to conclude the Mac-side releases of 2023 will be theiMac with M3 chips: apparently, therefore, Apple’s “entry-level” desktop will skip the M2 generation and will be the first device of the following one, mounting a “smooth” M3 chip under a body that is once again extremely colorful. Also, the chassis of the device should receive some changes, for example by reducing its thickness.